Product Details

3.96mm Wire to Board Wafer R/A Dip Type 2219R-XX

  • Model:2219R-XX
SPECIFICATIONS
  Mating part   2220H-XX
  Current rating   7.0A AC / DC
  Voltage rating   250V AC / DC
  Contact resistance   10m ohm. max.
  Insulation resistance   1,000M ohm. Min
  Withstand voltage    1,500V AC for one minute
  Operating temperature    -40°C ~ +105°C
  Material plating  
1. Insulator: Nylon 66 (UL94V-2)
2. Contact: Copper Aolly
3. Plating: Tin Plated
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