Product Details

3.96mm Wire to Board Wafer Straight Dip Type 2219S-XX

  • Model:2219S-XX
SPECIFICATIONS
  Mating part   2220H-XX
  Current rating   7.0A AC / DC
  Voltage rating   250V AC / DC
  Contact resistance   10m ohm. max.
  Insulation resistance   1,000M ohm. Min
  Withstand voltage    1,500V AC for one minute
  Operating temperature    -40°C ~ +105°C
  Material plating  
1. Housing: Nylon 66 (UL94V-0)
2. Contact: Brass
3. Plating: Tin Plated
    Inquiry Datasheet
     

    Related Products