Product Details

3.96mm Wire to Board Wafer Reserve R/A Dip Type 2114RR-XX-XX

  • Model:2114RR-XX-XX
SPECIFICATIONS
  Mating part   2220H-XX, 2220H-XX-SPX
  Current rating   7.0A AC / DC
  Voltage rating   250V AC / DC
  Contact resistance   10m ohm. max.
  Insulation resistance   1,000M ohm. Min
  Withstand voltage    1,500V AC for one minute
  Operating temperature    -40°C ~ +105°C
  Material plating  
1. Housing: Nylon 66 (UL94V-0)
2. Contact: Brass
3. Plating: Tin Plated
    Inquiry Datasheet
    Features
    Prevents mismating
    Secure contact and mounting
    Proven box contact
    Tape-and-reel packaging with pick-and-place caps available


    Application
    Automotive
    Control modules
    Interior lighting
    Consumer
    ATM
    Home appliances
    Washer/dryer
    Dishwashers
    Fire/smoke detectors
    Industrial
    Automation equipment
    Robotics
    Medical
    Respirators
    Blood warming bags
    Data/Computing
    Mainframes
    Printers
    Scanners
    Multi-function machines



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