Product Details

3.96mm Wire to Board Wafer Straight Dip type 2114S-XX-XX

  • Model：2114S-XX-XX
SPECIFICATIONS
  Mating part   2114H-XX
  Current rating   7.0A AC / DC
  Voltage rating   250V AC / DC
  Contact resistance   10m ohm. max.
  Insulation resistance   1,000M ohm. Min
  Withstand voltage    1,500V AC for one minute
  Operating temperature    -25°C ~ +105°C
  Material plating  
1. Insulator: Nylon 66 (UL94V-0)
2. Contact: Brass
3. Plating: Tin Plated
    Inquiry Datasheet
    Features
    ■ Prevents mismating
    ■ Secure contact and mounting
    ■ Proven box contact
    ■ Tape-and-reel packaging with pick-and-place caps available

    Application
    ■ Automotive
    Control modules
    Interior lighting
    ■ Consumer
    ATM
    Home appliances
    Washer/dryer
    Dishwashers
    Fire/smoke detectors
    ■ Industrial
    Automation equipment
    Robotics
    ■ Medical
    Respirators
    Blood warming bags
    ■ Data/Computing
    Mainframes
    Printers
    Scanners
    Multi-function machines


    Related Products

    3.96mm Wire to Board Wafer R/A Type 2114R-XX-XX

    • Original price：$
    • Price：$

    3.96mm Wire to Board Wafer Reserve R/A Dip Type 2114RR-XX-XX

    • Original price：$
    • Price：$

    3.96mm Wire to Board Housing Single Row Connector 2114H-XX

    • Original price：$
    • Price：$
    Top