Product Details

2.54mm Wire to Board Wafer Single Row Straight Dip Type 2217S1-XXX-AX

  • Model：2217S-XXX-AX
SPECIFICATIONS
  Mating part   2218H1A-XX
  Current rating   3.0A AC / DC
  Voltage rating   250V AC / DC
  Contact resistance   20m ohm. max
  Insulation resistance   1,000M ohm. Min
  Withstand voltage    1,000V AC for one minute
  Operating temperature    -45°C ~ +85°C
  Material plating  
1. Insulator: High Temperature Material (UL94V-0)
2. Contact: Brass
3. Plating:Gold Plated
    Inquiry Datasheet
       
    Top