Product Details

4.20mm Wire to Board Wafer Double Rows Molding Straight Dip Type 2266S-XX-M

Model：2266S-XX-M

SPECIFICATIONS

Mating part   2257-XX Series
Current rating   9.0A AC / DC
Voltage rating   600V AC / DC
Contact resistance   10m ohm. max.
Insulation resistance   1,000M ohm. Min
Withstand voltage    1,500V AC for one minute
Operating temperature    -40°C ~ +105°C
Material plating

1. Insulator: Nylon (UL94V-0)
2. Insulator Color: Transparent
3. Terminal: Brass
4. Plating: Tin Plated

Inquiry Datasheet

Product Details

4.20mm Wire to Board Wafer Double Rows Molding Straight Dip Type 2266S-XX-M

Product Introduction

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