Product Details

4.20mm Wire to Board Wafer Single Row Straight Dip Type 2269SA-XX-XX

  • Model：2269SA-XX-XX
SPECIFICATIONS
  Mating part   2257A-XX Series
  Current rating   9.0A AC / DC
  Voltage rating   600V AC / DC
  Contact resistance   10m ohm. max.
  Insulation resistance   1,000M ohm. Min
  Withstand voltage    1,500V AC for one minute
  Operating temperature    -40°C ~ +105°C
  Material plating  
1. Insulator: Nylon (UL94V-0)
2. Terminal: Brass Tin Plated
3. Wafer Insulator: Nylon (UL94V-0)
4. Contact Pin: Brass Tin Plated
 
    Inquiry Datasheet
    Features
    ■ Prevents accidental mismating
    ■ Blind-mating interface
    ■ Ensures a reliable connection
    ■ Fully isolated terminals
    ■ Ideal for applications requiring a high number of mating cycles

    Application
    ■ Industrial
    Industrial equipment
    Power suppliers
    ■ Consumer
    Copiers / Printers
    Freezers / Refrigerator
    Gaming equipment
    Vending machines
    Home appliances
    ■ Automotive
    Harness manufacturers
    Inside devices
    ■ Medical
    Medical devices
    X-rays
    ■ Telecommunications / Networking
    Routers and Switches
    Servers


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