商品詳細

2.54mm Wire to Board Wafer Double Rows R/A Dip Type 2217R2-XXX

  • 品番：2217R2-XXX
商品概要
  Mating part   2218H2A-XX
  Current rating   3.0A AC / DC
  Voltage rating   250V AC / DC
  Contact resistance   20m ohm. max
  Insulation resistance   1,000M ohm. Min
  Withstand voltage    1,000V AC for one minute
  Operating temperature    -45°C ~ +85°C
  Material plating  
1. Insulator: Nylon 66 (UL94V-0)
2. Contact: Brass
3. Plating:Gold Plated
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