Product Details

3.0mm Wire to Board Wafer Double Rows R/A Dip Type 5561R-XXX-01

  • Model：5561R-XXX-01
SPECIFICATIONS
  Mating part   5560-XX
  Current rating   5.0A AC / DC
  Voltage rating   250V AC / DC
  Contact resistance   10m ohm. max.
  Insulation resistance   1,000M ohm. Min
  Withstand voltage    1,500V AC for one minute
  Operating temperature    -25°C ~ +105°C
  Material plating  
1. Insulator: High Temperature Plastic (UL94V-2)
2. Contact: Copper Aolly
3. Plating:Tin Plated
    Inquiry Datasheet

    Features
    ■ Prevents accidental mismating
    ■ Ensures a reliable connection 
    ■ High-temperature LCP headers
    ■ SMT or through hole mount compatible versions available
    ■ Fully isolated terminals

    Application
    ■ Consumer
    Washers and Dryers
    Refrigerators and Freezers
    Printers and Scanners
    Security Systems
    Vending Machines
    ■ Automotive
    Inside Devices
    ■ Medical
    Healthcare IT 
    Patient Monitoring
    ■ Telecommunications / Networking
    Routers and Switches
    Servers
    ■ Sustainable Energy
    Solar Power


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