Product Details

2.54mm Wire to Board Wafer Single Row R/A Dip Type 2217R-XX-WH2

  • Model：2217R-XX-WH2
SPECIFICATIONS
  Mating part   2218H-XX
  Current rating   3.0A AC / DC
  Voltage rating   250V AC / DC
  Contact resistance   20m ohm. max
  Insulation resistance   1,000M ohm. Min
  Withstand voltage    1,000V AC for one minute
  Operating temperature    -25°C ~ +105°C
  Material plating  
1. Insulator: Nylon 66 (UL94V-0)
2. Contact: Copper Alloy
3. Plating:Tin Plated
    Inquiry Datasheet
     

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