Product Details

2.50mm Wire to Board Wafer Single Row Straight Dip Type 2317SJ-XX

  • Model：2317SJ-XX
SPECIFICATIONS
  Mating part    2318HJ-XX
  Current rating   3.0A AC / DC
  Voltage rating   250V AC / DC
  Contact resistance   20m ohm. max
  Insulation resistance   1,000M ohm. Min
  Withstand voltage    1,000V AC for one minute
  Operating temperature    -40°C ~ +85°C
  Material plating  
1. Insulator: Nylon 66 (UL94V-0)
2. Contact: Brass
3. Plating: Tin Plated
    Inquiry Datasheet
    Features
    ■ 2.50mm pitch, widely used on fields with high reliability and versatility performance.
    ■ Fully shrouded header, crimp style.
    ■ Prevents accidental mismating.

    Application
    ■ Industrial
    Machinery and Heavy Equipment
    Lighting and Automation
    ■ Medical
    Healthcare IT and Patient Monitoring
    ■ Home Appliance
    Washers and Dryers
    Heaters and Air Conditioners
    ■ Telecommunication/Networking
    Hubs and Servers
    Power Supplies and Distribution


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