2024/01/05 Nepcon Japan 2024


Nepcon Japan 2024

Date: Jan. 24 (Wed)- 26(Fri), 2024
Venue: Tokyo Big Sight, Tokyo, Japan
Booth number: E21-42

We sincerely invite you to participate in the upcoming Tokyo Electronics Expo, scheduled to take place from January 24-26, 2024. Our booth number is E21-42. As a leading electronics and technology expo in Asia, we will showcase a diverse range of products, including board-to-board connectors, wire-to-board connectors, Type-C connectors, Pin Headers, IDC, Press Fit connectors, waterproof M Series connectors, RF connectors, and various types of cables.

Being experts in the field of connectors and electronic components, we boast advanced manufacturing capabilities, including stamping, die casting, plastic injection molding, insert molding, and various assembly and processing equipment. This allows us to offer our customers a convenient and comprehensive one-stop service.

Our team will be on-site to provide expert support, demonstrate product functionalities, and answer any questions you may have. Whether you are seeking innovative connector technology or are interested in our products, we look forward to engaging with you and establishing a meaningful partnership.

Thank you for your attention, and we anticipate meeting you at the Japan International Electronics Manufacturing and Technology Show. Should you need more information or have any inquiries, please feel free to contact us. We are committed to serving you with dedication.